IEEE Rao R. Tummala Electronics Packaging Award
From ETHW
About Award
The IEEE Components, Packaging, and Manufacturing Technology Award was established in 2002, and was renamed the IEEE Electronics Packaging Award in 2017, and renamed in 2020 in honor of Professor Tummala.
Recipient selection is administered through the Technical Field Awards Council of the IEEE Awards Board.
Recipient List
- John W. Balde, 2004
- Yutaka Tsukada, 2005
- C. P. Wong, 2006
- Dimitry Grabbe, 2007
- Karl Puttlitz, 2008
- Paul A. Totta, 2008
- George G. Harman, 2009
- Herbert Reichl, 2010
- Rao R. Tummala, 2011
- Mauro J. Walker, 2012
- John H. Lau, 2013
- Avram Bar-Cohen, 2014
- Nasser Bozorg-Grayeli, 2015
- Michael Pecht, 2016
- Paul S. Ho, King-Ning Tu, 2017
- William T. Chen, 2018
- Ephraim Suhir, 2019
- Mitsumasa Koyanagi, Peter Ramm, 2020
- Chin C. Lee, 2021
- Douglas C.H. Yu, 2022
- Guoqi (Kouchi) Zhang, 2023
- Madhavan Swaminathan, 2024
- Jie Xue, 2025
