IEEE Rao R. Tummala Electronics Packaging Award

From ETHW

About Award[edit | edit source]

IEEE Components, Packaging, and Manufacturing Technology Award.jpg

The IEEE Components, Packaging, and Manufacturing Technology Award was established in 2002, and was renamed the IEEE Electronics Packaging Award in 2017, and renamed in 2020 in honor of Professor Tummala.

Recipient selection is administered through the Technical Field Awards Council of the IEEE Awards Board.

Recipient List[edit | edit source]