Jie Xue
Biography
Jie Xue is a technologist with three decades of contributions to high-performance networking systems and mobile wireless communications. As an engineering leader at Cisco for over 24 years, she led her team to develop system-level packaging technology roadmaps, driving a 20-fold bandwidth increase across generations of networking systems. Xue’s innovations encompass two crucial areas of packaging technologies, pushing industry boundaries with achievements like the large body size Fan-Out package for high-bandwidth and high-performance networking ASICs. Recognizing the need of technology transition to address power constraints in datacenter, she led the team in the eco-system development of Si-Photonic technology. Overall, her visionary leadership has had a transformative impact on the global networking industry.
An IEEE Fellow, Xue is Vice President of Technology and Quality, Cisco Systems, Inc., San Jose, CA, USA and is the 2025 recipient of the IEEE Rao R. Tummala Electronics Packaging Award for "contributions to industry-leading high-bandwidth networking systems, including advanced IC and Si-Photonic packaging."
