Chin C. Lee

Chin C. Lee

Awards

IEEE Electronics Packaging Award

Biography

Chin C. Lee’s innovative bonding methods and materials and new packaging technologies have been integral to developing high-temperature and high-power electronics. His work on silver wire bond reliability resulted in a wider process window, lower cost, and higher yield in packaging components. He also discovered that silver alloy is anti-tarnishing, which has had enormous economic and technical impact for applications including optics, astronomy telescopes, and LED packaging. His fluxless soldering technology has enabled numerous bonding designs and is critical to packaging electronics for applications where oxidation effects from solder materials can be problematic. Lee also developed solid-state flip-chip interconnects and formulated quantum bonding theory.

An IEEE Life Fellow, Lee is a professor (retired) with the University of California, Irvine, CA, USA.