With over 40 years of pioneering work in modelling and reliability engineering, Ephraim Suhir has enabled electronic packaging engineers to accurately predict stress in advanced packaged components for the design of more reliable devices. He was one of the earliest researchers to introduce the use of rigorous mechanics principles in electronic systems. His closed-form solutions have provided the electronics industry with invaluable tools for ensuring reliability and cost savings during the design process by eliminating errors early in the design process. He has applied his techniques to advanced components and packaged structures such as microelectronics, photonics, photo-voltaics, and thermoelectronic modules. Every serious mechanics practitioner and researcher in the electronics packaging field has been influenced by Suhir’s groundbreaking contributions.
An IEEE Life Fellow, Suhir is a professor with Portland State University, Portland, OR, USA, and is on the faculty of the Technical University, Vienna, Austria, and James Cook University, Queensland, Australia.