Douglas C.H. Yu

Douglas C.H. Yu

Awards

IEEE Rao R. Tummala Electronics Packaging Award

Biography

Douglas C.H. Yu’s leadership in developing advanced packaging technologies has paved the way for new technology standards and semiconductor trends that have supported the continued scaling of microelectronics and are enhancing high-performance computing, wireless, and artificial intelligence applications. Among Yu’s many accomplishments, at Taiwan Semiconductor Manufacturing Corporation he led the introduction of the copper/low-k dielectric interconnects, which provided a significant improvement in on-chip wiring performance. He also led the development of the innovative TSMC 3DFabric system integration technology platform, which includes chip-on-wafer-on-substrate (CoWoS), integrated fan-out (InFO) wafer-level-package, and system-on-integrated chip (SoIC) technologies. This holistic solution for advanced packaging is critical to continued improvement in performance, power, and form factor of heterogeneous integrated microelectronic systems for above-stated wide applications.

An IEEE Fellow and a Distinguished Fellow of TSMC Academy, Yu is vice president of Taiwan Semiconductor Manufacturing Company, Hsinchu, Taiwan.