Paul S. Ho
The patented innovations of Paul S. Ho and King-Ning Tu overcame the roadblocks caused by electromigration that limited high-performance chip reliability for the semiconductor and electronics industry. First addressing the issues with aluminum wiring, then copper, and eventually solder-bump connections, their work provided the foundation to understanding the science of the failure mechanisms and guided high-performance chip designs and manufacturing processes that enabled high-volume manufacturing of many silicon nodes with low cost and high reliability. Ho and Tu also provided insights and solutions regarding the failure mechanisms associated with low-k dielectric materials, tin whiskers, and electromigration in interconnects critical to the success of high-performance flip-chip technologies.
An IEEE Fellow, Ho is director of the Laboratory for Interconnect and Packaging at the University of Texas at Austin, Austin, TX, USA.