William T. Chen
William T. Chen is a visionary strategist, lead mentor for innovation, and hands-on engineer. His leadership has led to industrialization of game-changing packaging technologies by enabling miniaturization, cost reduction, and performance enhancements for today’s pervasive all-powerful electronic devices. They include development of copper wirebonds replacing gold interconnects, saving industry hundreds of millions of dollars a year and 2.5D packaging high-volume implementation, setting the standard for myriad interconnects in a small package space for applications including high-performance logic and memory. His strategic vision on fan-out wafer-level packaging is critical for meeting future demand for smaller, thinner, and faster electronic systems. Early in his career he pioneered the use of predictive verified modeling integrating micromechanics, materials science, and finite element crucial for generations of electronics products.
An IEEE Life Fellow, Chen is an ASE Fellow and senior technical advisor with ASE Group, Inc., Sunnyvale, CA, USA.