IEEE Electronics Packaging Society History
Electronics Packaging Society
In 2017, the IEEE Board of Directors approved the name change from the IEEE Components, Packaging and Manufacturing Technology Society (CPMT) to the IEEE Electronics Packaging Society (EP).
The IEEE Electronics Packaging Society is the leading international forum for scientists and engineers engaged in the research, design and development of revolutionary advances in microsystems packaging and manufacturing.
Its objectives are scientific, literary, and educational in character. The Society strives for the advancement of the theory and practice of electrical and electronics engineering and of the allied arts and sciences, and the maintenance of a high professional standing among its members and others and with special attention of such aims within the field of interest of the Society.
The EPS promotes close cooperation and exchange of technical information among its members and others through technical conferences and workshops, peer-reviewed publications, and collaboration with other organizations.
Fields of Interest:
The scientific, engineering, and production aspects of materials, components, modules, hybrids and micro-electronic systems for all electronic applications, which includes technology, , modeling/simulation, characterization, assembly, interconnection, packaging, handling, thermal management, reliability, testing/control of the above as applied in design and manufacturing. Examples include optoelectronics and bioelectronic systems packaging, and adaptation for operation in severe/harsh environments. Emphasis is on research, analysis, development, application and manufacturing technology that advance state-of-the-art within this .
Through its sponsored and cosponsored conferences and workshops held throughout the world, as well as its peer-reviewed Transactions containing articles from authors worldwide, the EPS provides the best available technical information.
Chapters throughout the US, Europe and Asia/Pacific provide opportunities for groups of local members to meet and participate in activities on a more frequent basis, often focusing on the particular profile of the locale.
The Society collaborates and cooperates with other IEEE Societies as well as with other professional associations through initiatives, publications, conferences and councils. Following are some of the areas and activities that EPS jointly sponsors or supports:
Activities and Initiatives
Heterogeneous Integration Road Map
Women in Engineering
Hardware Technology Roadmaps
ASMC, DTIP, EOS/ESD, EMPC, EuroSIME, ICEPT, ISSE, THERMINIC, EDAPS, EPEP, EPTC, ESTC, IEMT-EMAP, IWASI, IWIPP, SPI
IEEE Transactions on Semiconductor Manufacturing
IEEE Transactions on Nanotechnology
IEEE Nanotechnology Magazine
IEEE Internet of Things Journal
IEEE Sensors Journal
IEEE RFID Virtual Journal
IEEE Transactions on Applied Superconductivity
IEEE Journal on Exploratory Solid-State Computational Devices and Circuits
IEEE Journal on Photovoltaics
IEEE Transactions on NanoBioscience
IEEE Transactions on Big Data
IEEE Transactions on Multi-Scale Computing Systems
IEEE Transactions on Molecular, Biological, and Multi-Scale Communications
IEEE Journal of Electromagnetics, RF and Microwaves in Medicine and Biology
Components, Packaging and Manufacturing Technology
1978 - Name change to IEEE CHMT because of 1977 Merger of IEEE PHP and MT.
January 1, 1994 - Name change to Components, Packaging and Manufacturing Technology.
IEEE Product Engineering and Production Group
September 28, 1954 - Organizational meeting of the IRE Professional Group on Production Techniques
May 23, 1960 - Name change to IRE Professional Group on Product Engineering and Production
March 28, 1963 - Name change to Professional Technical Group on Product Engineering and Production
June 11, 1964 - Name change to IEEE Product Engineering and Production Group
July 1, 1965 - Product Engineering and Production Group merged with Group on Component Parts to become Parts, Materials, and Packaging Group
IEEE Parts, Hybrids, and Packaging Group
August 23, 1965 - First meeting of the Parts, Materials, & Packaging Group - merger of Component Parts and Product Engineering and Production Group.
March 23, 1971 - Name Change to IEEE Parts, Hybrids, and Packaging Group
IEEE Manufacturing Technology Group
March 23, 1972 - First Meeting IEEE of Manufacturing Technology Group
Electronics Packaging Society archival documents - Petitions, correspondence, constitutions and merger documents, 1953 - 1990