Stanley Danko


Stanley Danko
New York, NY, USA
Associated organizations
U.S. Army
Fields of study
Electronic components


Stanley F. Danko (IRE Member, 1946) was born in New York, N.Y., on 6 January 1916. He received the B.S. degree in electrical engineering from Cooper Union, New York, N.Y., in 1937, and pursued graduate studies in UHF techniques at the Moore School of Electrical Engineering, University of Pennsylvania, Philadelphia, and Rutgers University, New Brunswick, N.J.

Danko was employed in the U.S. Army Signal Corps Inspection Laboratory in Philadelphia from 1940 to 1946, joining the U.S. Army Signal Research and Development Laboratory at Fort Monmouth, N.J., in 1946. He was associated with the electronic component development activities at the Signal Research and Development Laboratory, specializing in the development of coaxial cables, RF connectors, inductive components and miniaturization techniques , including printed circuits and packaging of electronic assemblies. He was a principal in the establishment of the dip-soldered printed wiring process (Auto-Sembly) in use by the early 1960s. In 1957, Danko received a Department of the Army Award for his miniaturization contributions. In 1962, he was Chief of the Electronic Parts and Assemblies Branch of the Electronic Components Department of the U.S. Army Signal Research and Development Laboratory.

In 1962, Danko was a Member of the IRE, Secretary of the IRE Professional Group on Military Electronics, an Associate Member of the IRE Working Group on Planning and Requirements of the Advisory Group on Electron Devices, and a registered professional engineer in Pennsylvania.