Category:Electronic packaging thermal management: Difference between revisions
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[[Image:Electronics Packaging Thermal Management Thermopile quad sensor Attribution.jpg|thumb|right|A 4 channel thermopile sensor in a TO-8 package - Photo in the public domain ]] | [[Image:Electronics Packaging Thermal Management Thermopile quad sensor Attribution.jpg|thumb|right|A 4 channel thermopile sensor in a TO-8 package - Photo in the public domain ]] | ||
The use of the packaging in electronic circuits to limit and control heat | |||
[[Category:Thermal_management_of_electronics|{{PAGENAME}}]] | [[Category:Thermal_management_of_electronics|{{PAGENAME}}]] |
Latest revision as of 15:47, 30 January 2013
The use of the packaging in electronic circuits to limit and control heat
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