Kaustav Banerjee’s and Vivek Subramanian’s pioneering use of nanomaterials and radical innovations in devices, interconnects, circuits, and design methods for overcoming power, thermal, and other fundamental challenges in both nanoscale integrated circuits (ICs) and printed electronics have been crucial to the continued scaling of electronic devices, as well as increasing reliability and lowering costs of ICs and large-area printed/flexible electronics. Prof. Banerjee is considered one of the key visionaries behind three-dimensional (3D) IC technology being employed by the semiconductor industry for continued scaling and integration beyond Moore’s law, as well as the pioneer behind thermal-aware design methods and tools used in the IC design industry. Their work is also driving changes in chip architecture, circuit design, design automation, and chip packaging/cooling as well as physical aspects of wafer and display fabrication and interconnection structures. Profs. Banerjee and Subramanian have also made innovative contributions to the development of low-power and low-cost electronic noses and biosensors.
An IEEE Fellow, Dr. Banerjee is currently a professor with the Department of Electrical and Computer Engineering at the University of California, Santa Barbara, CA, USA.