Difference between revisions of "IEEE Electronics Packaging Society History"

 
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== Electronics Packaging Society ==
+
==Electronics Packaging Society==
  
 
In 2017, the IEEE Board of Directors approved the name change from the IEEE Components, Packaging and Manufacturing Technology Society (CPMT) to the IEEE Electronics Packaging Society (EP).
 
In 2017, the IEEE Board of Directors approved the name change from the IEEE Components, Packaging and Manufacturing Technology Society (CPMT) to the IEEE Electronics Packaging Society (EP).
  
== Components, Packaging and Manufacturing Technology ==
+
The IEEE Electronics Packaging Society is the leading international forum for scientists and engineers engaged in the research, design and development of revolutionary advances in microsystems packaging and manufacturing.
 +
 
 +
Its objectives are scientific, literary, and educational in character. The Society strives for the advancement of the theory and practice of electrical and electronics engineering and of the allied arts and sciences, and the maintenance of a high professional standing among its members and others and with special attention of such aims within the field of interest of the Society.
 +
 
 +
The EPS promotes close cooperation and exchange of technical information among its members and others through technical conferences and workshops, peer-reviewed publications, and collaboration with other organizations.
 +
 
 +
Fields of Interest:
 +
 
 +
The scientific, engineering, and production aspects of materials, components, modules, hybrids and micro-electronic systems for all electronic applications, which includes technology, , modeling/simulation, characterization, assembly, interconnection, packaging, handling, thermal management, reliability, testing/control of the above as applied in design and manufacturing. Examples include optoelectronics and bioelectronic systems packaging, and adaptation for operation in severe/harsh environments. Emphasis is on research, analysis, development, application and manufacturing technology that advance state-of-the-art within this .
 +
 
 +
Global Reach
 +
 
 +
Through its sponsored and cosponsored conferences and workshops held throughout the world, as well as its peer-reviewed Transactions containing articles from authors worldwide, the EPS provides the best available technical information.
 +
 
 +
Local Activities
 +
 
 +
Chapters throughout the US, Europe and Asia/Pacific provide opportunities for groups of local members to meet and participate in activities on a more frequent basis, often focusing on the particular profile of the locale.
 +
 
 +
Joint Activities
 +
 
 +
The Society collaborates and cooperates with other IEEE Societies as well as with other professional associations through initiatives, publications, conferences and councils. Following are some of the areas and activities that EPS jointly sponsors or supports:
 +
 
 +
Activities and Initiatives
 +
 
 +
Heterogeneous Integration Road Map
 +
 
 +
Young Professionals
 +
 
 +
Women in Engineering
 +
 
 +
IoT
 +
 
 +
IEEE Quantum
 +
 
 +
Rebooting Computing
 +
 
 +
Initiative
 +
 
 +
5G
 +
 
 +
Hardware Technology Roadmaps
 +
 
 +
Conferences
 +
 
 +
ASMC, DTIP, EOS/ESD, EMPC, EuroSIME, ICEPT, ISSE, THERMINIC, EDAPS, EPEP, EPTC, ESTC, IEMT-EMAP, IWASI, IWIPP, SPI
 +
 
 +
Publications
 +
 
 +
IEEE Transactions on Semiconductor Manufacturing
 +
 
 +
IEEE Transactions on Nanotechnology
 +
 
 +
IEEE Nanotechnology Magazine
 +
 
 +
IEEE Internet of Things Journal
 +
 
 +
IEEE Sensors Journal
 +
 
 +
IEEE RFID Virtual Journal
 +
 
 +
IEEE Transactions on Applied Superconductivity
 +
 
 +
IEEE Journal on Exploratory Solid-State Computational Devices and Circuits
 +
 
 +
IEEE Journal on Photovoltaics
 +
 
 +
IEEE Transactions on NanoBioscience
 +
 
 +
IEEE Transactions on Big Data
 +
 
 +
IEEE Transactions on Multi-Scale Computing Systems
 +
 
 +
IEEE Transactions on Molecular, Biological, and Multi-Scale Communications
 +
 
 +
IEEE Journal of Electromagnetics, RF and Microwaves in Medicine and Biology
 +
 
 +
==Components, Packaging and Manufacturing Technology==
  
 
1978 - Name change to IEEE CHMT because of 1977 Merger of IEEE PHP and MT.  
 
1978 - Name change to IEEE CHMT because of 1977 Merger of IEEE PHP and MT.  
Line 9: Line 85:
 
January 1, 1994 - Name change to Components, Packaging and Manufacturing Technology.  
 
January 1, 1994 - Name change to Components, Packaging and Manufacturing Technology.  
  
== IEEE Product Engineering and Production Group ==
+
==IEEE Product Engineering and Production Group==
  
 
September 28, 1954 - Organizational meeting of the [[IRE History 1912-1963|IRE]] Professional Group on Production Techniques  
 
September 28, 1954 - Organizational meeting of the [[IRE History 1912-1963|IRE]] Professional Group on Production Techniques  
Line 21: Line 97:
 
July 1, 1965 - Product Engineering and Production Group merged with Group on Component Parts to become Parts, Materials, and Packaging Group  
 
July 1, 1965 - Product Engineering and Production Group merged with Group on Component Parts to become Parts, Materials, and Packaging Group  
  
== IEEE Parts, Hybrids, and Packaging Group ==
+
==IEEE Parts, Hybrids, and Packaging Group==
  
 
August 23, 1965 - First meeting of the Parts, Materials, & Packaging Group - merger of Component Parts and Product Engineering and Production Group.  
 
August 23, 1965 - First meeting of the Parts, Materials, & Packaging Group - merger of Component Parts and Product Engineering and Production Group.  
Line 27: Line 103:
 
March 23, 1971 - Name Change to IEEE Parts, Hybrids, and Packaging Group  
 
March 23, 1971 - Name Change to IEEE Parts, Hybrids, and Packaging Group  
  
== IEEE Manufacturing Technology Group ==
+
==IEEE Manufacturing Technology Group==
  
 
March 23, 1972 - First Meeting IEEE of Manufacturing Technology Group  
 
March 23, 1972 - First Meeting IEEE of Manufacturing Technology Group  
  
== Archival Documents ==
+
==Archival Documents==
  
[[Media:Electronics_packaging_society_archival_documents.pdf|Electronics Packaging Society archival documents]] - Petitions, correspondence, constitutions and merger documents, 1953 - 1990
+
[[Media:Electronics packaging society archival documents.pdf|Electronics Packaging Society archival documents]] - Petitions, correspondence, constitutions and merger documents, 1953 - 1990
  
== Further Reading ==
+
==Further Reading==
  
 
[http://www.cpmt.org/ Link to IEEE Components Packaging, and Manufacturing Technology Society]  
 
[http://www.cpmt.org/ Link to IEEE Components Packaging, and Manufacturing Technology Society]  
  
[[Category:IEEE|Components]] [[Category:Geographical units|Components]] [[Category:Societies|Components]] [[Category:Computing and electronics|Components]]
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[[Category:IEEE|Components]]  
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[[Category:Geographical units|Components]]  
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[[Category:Societies|Components]]  
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[[Category:Computing and electronics|Components]]

Latest revision as of 00:12, 8 November 2019

Electronics Packaging Society

In 2017, the IEEE Board of Directors approved the name change from the IEEE Components, Packaging and Manufacturing Technology Society (CPMT) to the IEEE Electronics Packaging Society (EP).

The IEEE Electronics Packaging Society is the leading international forum for scientists and engineers engaged in the research, design and development of revolutionary advances in microsystems packaging and manufacturing.

Its objectives are scientific, literary, and educational in character. The Society strives for the advancement of the theory and practice of electrical and electronics engineering and of the allied arts and sciences, and the maintenance of a high professional standing among its members and others and with special attention of such aims within the field of interest of the Society.

The EPS promotes close cooperation and exchange of technical information among its members and others through technical conferences and workshops, peer-reviewed publications, and collaboration with other organizations.

Fields of Interest:

The scientific, engineering, and production aspects of materials, components, modules, hybrids and micro-electronic systems for all electronic applications, which includes technology, , modeling/simulation, characterization, assembly, interconnection, packaging, handling, thermal management, reliability, testing/control of the above as applied in design and manufacturing. Examples include optoelectronics and bioelectronic systems packaging, and adaptation for operation in severe/harsh environments. Emphasis is on research, analysis, development, application and manufacturing technology that advance state-of-the-art within this .

Global Reach

Through its sponsored and cosponsored conferences and workshops held throughout the world, as well as its peer-reviewed Transactions containing articles from authors worldwide, the EPS provides the best available technical information.

Local Activities

Chapters throughout the US, Europe and Asia/Pacific provide opportunities for groups of local members to meet and participate in activities on a more frequent basis, often focusing on the particular profile of the locale.

Joint Activities

The Society collaborates and cooperates with other IEEE Societies as well as with other professional associations through initiatives, publications, conferences and councils. Following are some of the areas and activities that EPS jointly sponsors or supports:

Activities and Initiatives

Heterogeneous Integration Road Map

Young Professionals

Women in Engineering

IoT

IEEE Quantum

Rebooting Computing

Initiative

5G

Hardware Technology Roadmaps

Conferences

ASMC, DTIP, EOS/ESD, EMPC, EuroSIME, ICEPT, ISSE, THERMINIC, EDAPS, EPEP, EPTC, ESTC, IEMT-EMAP, IWASI, IWIPP, SPI

Publications

IEEE Transactions on Semiconductor Manufacturing

IEEE Transactions on Nanotechnology

IEEE Nanotechnology Magazine

IEEE Internet of Things Journal

IEEE Sensors Journal

IEEE RFID Virtual Journal

IEEE Transactions on Applied Superconductivity

IEEE Journal on Exploratory Solid-State Computational Devices and Circuits

IEEE Journal on Photovoltaics

IEEE Transactions on NanoBioscience

IEEE Transactions on Big Data

IEEE Transactions on Multi-Scale Computing Systems

IEEE Transactions on Molecular, Biological, and Multi-Scale Communications

IEEE Journal of Electromagnetics, RF and Microwaves in Medicine and Biology

Components, Packaging and Manufacturing Technology

1978 - Name change to IEEE CHMT because of 1977 Merger of IEEE PHP and MT.

January 1, 1994 - Name change to Components, Packaging and Manufacturing Technology.

IEEE Product Engineering and Production Group

September 28, 1954 - Organizational meeting of the IRE Professional Group on Production Techniques

May 23, 1960 - Name change to IRE Professional Group on Product Engineering and Production

March 28, 1963 - Name change to Professional Technical Group on Product Engineering and Production

June 11, 1964 - Name change to IEEE Product Engineering and Production Group

July 1, 1965 - Product Engineering and Production Group merged with Group on Component Parts to become Parts, Materials, and Packaging Group

IEEE Parts, Hybrids, and Packaging Group

August 23, 1965 - First meeting of the Parts, Materials, & Packaging Group - merger of Component Parts and Product Engineering and Production Group.

March 23, 1971 - Name Change to IEEE Parts, Hybrids, and Packaging Group

IEEE Manufacturing Technology Group

March 23, 1972 - First Meeting IEEE of Manufacturing Technology Group

Archival Documents

Electronics Packaging Society archival documents - Petitions, correspondence, constitutions and merger documents, 1953 - 1990

Further Reading

Link to IEEE Components Packaging, and Manufacturing Technology Society