File:Integrated Circuits Manufacturing Packaging and Distribution 1993 Ceramic Rectangle Integrated Circuit Package Attribution.jpg

No higher resolution available.

File history

Click on a date/time to view the file as it appeared at that time.

	Date/Time	Thumbnail	Dimensions	User	Comment
current	19:30, 9 March 2012		450 × 600 (42 KB)	Beichner (talk \| contribs)

You cannot overwrite this file.

The following page uses this file:

This file contains additional information, probably added from the digital camera or scanner used to create or digitize it.

If the file has been modified from its original state, some details may not fully reflect the modified file.

JPEG file comment	LEAD Technologies Inc. V1.01