- Fields of study
- Thermal packaging
Avram Bar-Cohen has defined and guided the emergence of thermal packaging as a critical engineering domain, addressing the consequences of heat generation within ever-shrinking electronic components. He has laid the scientific foundations for the thermal management of electronic components with seminal research on air-cooled heat sinks and liquid cooling of logic and radio-frequency devices. Engineered thermal management devices and heat flow paths are necessitated by the consequences of heat generation within electronic components, as uncontrolled temperatures can cause degradation in performance and reliability of solid-state devices. Dr. Bar-Cohen’s work has formed the basis of thermal courses taught today and has driven advances in applications ranging from consumer electronics to super-computing platforms. He is also leading the way in the emerging area of embedded microfluidic cooling techniques.
An IEEE Fellow, Dr. Bar-Cohen is a Distinguished University Professor of Mechanical Engineering at the University of Maryland, College Park, MD, USA. Bar-Cohen was the recipient of the 2014 IEEE Components, Packaging, and Manufacturing Technology Award.